Our sensor production process follows a precise, controlled, and quality-driven workflow designed to ensure consistent performance, reliability, and scalability. Each stage is carefully managed, beginning with custom sensor design and simulation, where application requirements are translated into optimized sensor structures and layouts.
Once the design is finalized, sensor fabrication moves to die bonding, where the sensor die is accurately mounted onto the package or substrate. This step is critical for ensuring proper thermal conduction, mechanical stability, and long-term reliability. We use carefully selected bonding materials and controlled processes to minimize stress and ensure consistent attachment quality.
The process continues with wire bonding, where fine metal wires establish secure electrical connections between the sensor die and package leads. Our wire bonding techniques are optimized to achieve strong bond integrity, low electrical resistance, and high resistance to vibration and thermal cycling.
Throughout the production flow, strict process controls and inspections are applied to maintain alignment accuracy, bond strength, and electrical performance. This disciplined approach ensures that every sensor meets defined functional and performance specifications before moving to final packaging and testing.